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Laser PCB Depaneling -YSVC-2 Model: YSVC-2 The Longest Minimize: 330mm Size: 620mm X 230mm X 400mm Minimize thickness: 0.3-3.5mm Machine Weight: 165kg Laser PCB Depaneling -YSVC-2 1.Separates boards up to 2.5mm thick 2.Shears boards safely with parts as close as 0.5mm to the score line, including ceramic capacitors 3.Operator foolproof! Panels cannot be inserted into the knives except on the score line 4.Pneumatically driven 5.Handles high components up to 1" 6.Bow waves that can occur with round knives are avoided 7.Easy adjusting of distance between knives |
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