Selective Soldering System
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Selective Soldering System-M


Equipment parameters

Dimension (LxWxH)

950 x 1780 x

1565 (mm)

1100 x 1980 x

1565 (mm)

1700 x 1780 x

1565 (mm)

2000 x 1980 x

1565 (mm)


Transport Parameters

Transport widthadjustment

50- 460 (mm)

50- 610 (mm)

50- 460 (mm)

50- 610 (mm)

PCB size

510 x 460 (mm)

610 x 610 (mm)

510 x 460 (mm)

610x610 (mm)

Conveyor height

900 ±(mm)




Thesolderingsystem

So lder pot

Electromagnetic pump tin solder pot

Solderpot numbers

single pot  dual pots  dual pots individual control

The amount of tin dross

0.5KG/ pot / week x1

Nitrogen consumptio

1.5m³h/ pot x 1

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