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High efficiency Desktop selective wave soldering YS-E320 for SMT production line
Discription:
Specification items
YS-E320
Applicable PCB board size
L*W : 50×50～450×400 mm
Applicable PCB board thickness
Substrate thickness：0.8～3 mm / Pin length：Within 3mm
Component height
Less than 100mm above the substrate / Less than 50mm below the substrate
Substrate shape and conditions
1.Substrate placement edge：The edge of the substrate process is more than 3mm
2The weight including components is less than 5 kilograms
3.The bending of the substrate: less than 0.5mm
Tin furnace
Tin furnace material/capacity：Stainless steel material / 10KG tin tank capacity：Power：4*500W 2 KW
N2 Requirements
Nitrogen purity：99.999%
Pressure/Consumption：0.5MPa / 20ℓ/min～30ℓ/min /
1.2-1.5Cube H
Flux nozzle
Precision fluid nozzle
Flux capacity
2 L （Manual liquid addition)
Gas source
0.5-0.7Mpa
Nozzle inner diameter
φ 3mm~φ 20mm Customizable size
Peak height
Automatic alignment/height measurement
System control
PC+PLC（windows+Huichuan）
Programming software
Support programming for drawing lines on pictures（Convenient and fast）
Power supply/power
Single-phase 220V±10% Starting power：2.5KW
Weight
70KG （Containing solder10KG）
External dimensions
L*W*H 730×800×840 mm
Preheat the top the PCB board
Preheat the top of the PCB board（Optional）
A 1KW infrared heating tube is adopted to preheat the PCB board before soldering,
which meets the high temperature requirements of special components, reduces the thermal
shock of components, activates the activity of flux, improves the tin penetration
of component pins, and enhances the soldering quality
Preheat the bottom of the PCB board
Preheating the bottom of the PCB board
Taking advantage of the fast heat conduction speed of infrared rays, the PCB board is preheated before soldering and maintained at the set frequency during soldering to prevent temperature drop of the PCB board during soldering.
It belongs to the design principle of "preheating + soldering" carried out simultaneously, which improves the soldering efficiency and the tin penetration rate of components, and reduces thethermal shock caused by the sudden heat
of heat-sensitive components. The cleanliness ratioof the PCB board after soldering is relatively high.
Email: caojun@hk-yush.com / evaliu@hk-yush.com